■ Ultra-flat surface lapping of ceramics
Machining of large-diameter ceramics is possible with submicron flatness and single nano-order surface roughness.
■ Ultra-flat surface lapping of sapphire
Sapphire, which is hard to be mirror-surface finished by grinding, can be finished with submicron flatness and surface roughness below Ra1nm. Nagase has an excellent track record of machining sapphire.
■ Ultra-high efficiency lapping of SiC
Lapping of monocrystal SiC wafer is possible with efficiency and flatness that were not available with conventional machines.
■ Ultra-efficiency lapping of crystallized glass
Quality and efficiency lapping of hard glass materials
Large-area machining is also possible.
1. Facing accuracy below 1μm
Surprising flatness and machining rate
Superior table rotation accuracy
Facing of a meter-size surface plate can be done with flatness of below 1μm.
The ultra-flat surface plate and accurate rotation allow the loose grain to work effectively and achieve unconventionally efficient machining.
2. Rigid and ultra-low vibration structure for high repeatability and quality
The non-contact and polyhedral constraint static guideway with no friction or wear and minimized gap is employed in the table axis. Not only accurate rotation but also excellent vibration damping is realized. In addition, the ultra-rigid frame structure achieves high-flatness machining. Repeatability, quality and flatness are all ensured in machining.
3. Two-step pressure setting (by automatic switching)
Pressure can be automatically switched in 2 steps up to 120kgf.
4. Flat surface machining and deep grooving
Using the facing unit enables flat surface machining and deep grooving of surface plates accurately.
5. Changing the program enables corner rounding of surface plates
Changing the program enables corner rounding of surface plates (optional).
■ Facing unit and ultra-low vibration surface plate
Ultra-high speed inverse rotation achieves accurate and efficient machining.
■ High-rigidity frame structure
Unconventionally high accuracy, flatness and machining rate
■ Correction ring
■ Ceramic ring for workpiece
■ Cooling unit
■ Forcible drive unit
○ Super-precision lapping machine PLM-610
This compact model is most suitable for efficient ultra-flat lapping of semiconductor and electronic materials such as ceramics, sapphire, SiC, etc.
Nagase has a proven track record of manufacturing large quantities of this model.
○ Super-precision lapping machine PLM-1750
A model compliant with ultra-flat surface lapping of large-diameter ceramic, sapphire and glass materials
Application of technology enables the development of machines to cope with a maximum of φ2700-sized area.
|Model/item||Size||Work face plate size||Surface plate size||Surface plate rotation speed||Facing unit||Machine weight|
■ Contents and specifications are subject to change without prior notice. The contents of description and pictures may contain optional items. To place an order, check the manufacture specifications for detailed contents.
■ Actual machine accuracy and machining accuracy described on this site may differ depending on the measurement and machining conditions.
■ For further details, you may request specifications, technical information, etc.
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■ This product must not be transferred for any purposes of use that prevents international peace and security, or used for one’s own purpose or by any third party.
Customers who are thinking of introducing new facilities are welcome to ask us for test machining or to visit our factory. Please feel free to consult us. Inform us of your facility conditions, size and material of machining workpieces, machining time, etc., in details.
Sales personnel in your district will make a proposal designed to meet your requirements.