Roughness：Ra 0.61nm,Rz 4.80nm
Roughness：Ra 0.69nm,Rz 5.12nm
Rate：75μm／min（rough process）
Material：Pure nickel
Size：155×130mm
Machine：NSF-600
Rate：1.0μm／min（rough process）
Flatness：0.93μm／4 inches × 3 pieces
Roughness：Ra 0.8nm,Rz 4.9nm
Material：Single-crystal SiC wafer
Size：4 inches ×3 pieces
Machine：PLM-610sh
Rate：100mm／sec
Chipping：Less than 30μm
Material：Single-crystal SiC wafer
Chip size：1.5×1.5×0.15mm
Machine：SPS-LR150・NVK-100
Chipping：Less than 5μm
Material：Single-crystal SiC wafer
Chip size：2.0×3.0×0.15mm
Machine：SPS-LR150・NVK-100
Chipping：Less than 5μm
Material：LN(Lithium niobate)
Chip size：2.0×2.0×0.15mm
Machine：SPS-LR150・NVK-100
Chipping：Less than 5μm
Material：LT(Lithium tantalate)
Chip size：2.0×2.0×0.15mm
Machine：SPS-LR150・NVK-100
Chipping：Less than 10μm
Roughness of slice surface：Ra 2.2nm, Rz 41nm
Material：Hardened glass
Size：80×40×0.7mm
Machine：NAC-555
Pitch accuracy：Less than 2μm
Groove width：1mm
Groove depth：4mm
Materials：HPM38
Size：40×40×4mm
Machine：SPG-150BL3-N3
Chipping：Less than 0.04mm
Groove width：1mm
Groove depth：25mm
Material：Crystal
Size：190×75×25mm
Machine：SPG-150BL3-N3
Inquiries
Consultations are free of charge. For those who are thinking of introducing any equipment, a machining test will basically be available at free of charge.
Provide the sales personnel at one of our local sales office with information about required accuracy, workpiece size and material. We will review your requirements at our technical center and reply to your inquiry.
