Thinning and Back Grainding of SiC Power-Device
Grinding Example of Ultra Precision Grinding Machine 2
「化合物半導体加工」に強い超精密研削盤はナガセインテグレックス。超精密グラインダーNSFseriesによるSiC・GaNパワーデバイスなどのバックグラインディング、薄化加工事例をご紹介。
Back Grinding of SiC Substrates with Highest Efficiency and Lowest Cost.
Thinning and back grinding of SiC refers to a process to reduce the thickness of SiC substrates to improve performance, mainly in applications such as power devices. Also called BG or back grinding. NAGASE's pressure and motion synshronized control surface grinding is an innovative machining method created to thin and flatten highly hard, brittle materials such as SiC with high efficiency and precision. Compared to conventional in-feed grinding, this system can efficiently ultra-thin 6-inch SiC with several times higher efficiency and less tool wear.
Works
Thinning and BG Processing of Single Crystal SiC Wafer
(Back grinding)
Rate: 94μm/min *Pre-processing estimates
Material: Single-crystal SiC wafer
Machine: NSF-350
Flatness Grinding of SiC Wafer
TTV: 1μm, LTV: 0.8μm
Material: Single-crystal SiC wafer
Size: 4"
Machine: NSF-350
Mirror Grinding of SiC Wafer (C-side)
Roughness: 0.61nmRa, 4.80nmRz
Material: Single-crystal SiC wafer
Size: 4"
Machine: NSF-350
SiC Wafer Thinned Down to 20μm
SORI: Minimum
Size: 2" x 3 sheets process
Ultra Thin Grinding of Aluminum Ceramics
Parallelism: 1μm
Rate: 50μm/min
Material: Aluminum ceramics
Size: 100 x 100 x 0.1mm
Machine: NSF-600
Ultra Efficient and Thin Flatness Prosess of Pure Nickel
Roughness: 0.69nmRa, 5.12nmRz
Rate: 75μm/min (rough process)
Material: Pure nickel
Size: 155 x 130mm
Machine: NSF-600
Ultra Mirror Surface Grinding of Low Thermal Expansion Glass
Roughness: 0.69nmRa, 5.12nmRz
Material: Low thermal expansion glass
Size: ⌀200 x 25mm
Machine: NSF-600
Ultra Mirror Surface Grinding of Carbide
Roughness: 0.6nmRa, 3.9nmRz
Material: Carbide
Size: ⌀70mm
Machine: NSF-600
Inquiries
We are experts in ultra-precision machining, If you have any type of machining problems, please feel free to consult us.
Consultations are free of charge. First, please tell us about the precision, size, materials, etc. related to the machining you are considering.
For test machining, prototype machining support, or equipment utilization, our experienced engineers at our Technical Center will examine the most appropriate methods and respond promptly.
(For urgent cases, please contact our regional sales offices.)