Slicing and Grooving Hard to Cut Materials
Machining Examples of Ultra Precision Slicing Machine
化合物半導体加工に強いスクライバ／スライシングマシンはナガセインテグレックス。SPS／SPGseriesによるSiCやLT・LN、水晶デバイスなどのスクライビング加工／スライシング加工事例をご紹介。
Highly Efficient Machining of Hard to Cut Materials from One-Pass Full Cutting to Narrow Grooving
Slicing (cutting process) is a process of cutting or grooving materials using tools such as diamond wheels. Realized processing of various materials such as glass, ceramics, and crystals.
Slicing Works
High Efficiency Grooving of HPM38
Pitch accuracy: Less than 2μm
Groove width: 1mm
Groove depth: 4mm
Material: HPM38
Size: 40 x 40 x 4mm
Machine: SPG-150BL3-N3
High Efficiency Cutting of Crystal
Chipping: Less than 0.04mm
Groove width: 1mm
Groove depth: 25mm
Material: Crystal
Size: 190 x 75 x 25mm
Machine: SPG-150BL3-N3
High Efficiency Grooving of HPM38
Pitch accuracy: ±2μm
Groove width: 1mm
Groove depth: 4mm
Material: HPM38
Size: 40 x 40 x 4mm
Machine: SPG-150BL3-N3
High Efficiency Cutting of BK7
Chipping: Less than 0.04mm
Groove width: 1.1mm
Groove depth: 25mm
Material: BK-7
Size: 185 x 75 x 25mm
Machine: SPG-150BL3-N3
Inquiries
We are experts in ultra-precision machining, If you have any type of machining problems, please feel free to consult us.
Consultations are free of charge. First, please tell us about the precision, size, materials, etc. related to the machining you are considering.
For test machining, prototype machining support, or equipment utilization, our experienced engineers at our Technical Center will examine the most appropriate methods and respond promptly.
(For urgent cases, please contact our regional sales offices.)