Lapping of SiC and Ceramics Materials
Machining Example of Ultra Precision Lapping Machine
「化合物半導体加工」に強い超精密ラップ盤はナガセインテグレックス。超精密ラップ盤PLMseriesによるSiCやサファイアウェハ、セラミックス部材などのラップ加工事例をご紹介。
Lapping Process to Change the Efficiency and Accuracy of Large SiC and Ceramic Components.
Polishing (Lapping) is a processing method that uses loose abrasive grains (slurry) to polish the surface of a wafer or workpiece. Also called mirror polishing or lapping process. NAGASE has developed an ultra-large lapping machine for high-precision machining of large ceramic parts and sapphire wafers, which are difficult to mirror-finish by grinding. Facing accuracy of less than 1μm at ⌀2m. The amount of abrasive grains processed is large, enabling ultra-mirror finishing of SiC, ceramic parts, sapphire, and other materials at approximately twice the efficiency of conventional methods.
Works
Lapping of SiC Wafer (High efficiency, Mirror finish)
Rate: 1.0μm/min (rough processing)
Flatness: 0.93μm/4" x 3 sheets
Roughness: 0.8nmRa, 4.9nmRz
Material: Single-crystal SiC wafer
Size: 4" x 3 sheets
Machine: PLM-610sh
Ultra Mirror Lapping of 6" Sapphire
Roughness: 0.6nmRa, 3.9nmRz
Flatness: 0.5μm
Material: Sapphire
Size: 6"
Machine: PLM-610sh
Ultra Mirror Lapping of Alumina Ceramics
Flatness: 0.53μm
Roughness: 1.8nmRa, 11nmRz
Material: Aluminum ceramics
Size: ⌀125mm
Machine: PLM-610sh
Ultra Mirror Lapping of Crystallized Glass
Roughness: 4.4nmRa, 0.65nmRz
Material: Crystallized glass
Size: ⌀95mm
Machine: PLM-610sh
Inquiries
We are experts in ultra-precision machining, If you have any type of machining problems, please feel free to consult us.
Consultations are free of charge. First, please tell us about the precision, size, materials, etc. related to the machining you are considering.
For test machining, prototype machining support, or equipment utilization, our experienced engineers at our Technical Center will examine the most appropriate methods and respond promptly.
(For urgent cases, please contact our regional sales offices.)